Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11699646 | Semiconductor structure | Chun-Hung Chen | 2023-07-11 |
| 11569188 | Semiconductor device including elongated bonding structure between the substrate | Chung-Hsing Kuo, Chun-Ting Yeh | 2023-01-31 |
| 11557558 | Structure of semiconductor device and method for bonding two substrates | Zhirui Sheng, Hui-Ling Chen, Chung-Hsing Kuo, Chun-Ting Yeh, Chien-En Hsu | 2023-01-17 |