| 11854920 |
Embedded chip package and manufacturing method thereof |
Jindong FENG, Benxia HUANG, Lei Feng, Wenshi Wang |
2023-12-26 |
| 11822121 |
Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof |
Lei Feng, Benxia HUANG, Wenshi Wang, Lina JIANG |
2023-11-21 |
| 11770859 |
Information transmission method, and base station, terminal and computer-readable storage medium |
Kun Liu, Bo Dai, Huiying Fang, Weiwei Yang |
2023-09-26 |
| 11769733 |
Package substrate |
Yejie HONG, Benxia HUANG, Lei Feng |
2023-09-26 |
| 11743902 |
Information transmission method and apparatus |
Weiwei Yang, Bo Dai, Kun Liu, Huiying Fang |
2023-08-29 |
| 11722854 |
Multicast transmission method and apparatus, and computer storage medium |
Bo Dai, Jianxun Ai, Kun Liu, Weiwei Yang, Huiying Fang |
2023-08-08 |
| 11689333 |
Signal transmission method and system |
Kun Liu, Bo Dai, Weiwei Yang, Huiying Fang |
2023-06-27 |
| 11682621 |
Connector for implementing multi-faceted interconnection |
Lei Feng, Benxia HUANG, Yejie HONG |
2023-06-20 |
| 11653364 |
Methods and apparatus for configuring a scheduling request |
Bo Dai, Huiying Fang, Weiwei Yang, Kun Liu |
2023-05-16 |
| 11595183 |
Joint resource assigning method and device for allocating resources to terminal |
Huiying Fang, Bo Dai, Weiwei Yang, Kun Liu |
2023-02-28 |
| 11595166 |
Data transmission method and apparatus |
Bo Dai, Jing Shi, Shuqiang Xia, Wen Zhang, Huiying Fang |
2023-02-28 |
| 11579362 |
Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof |
Lei Feng, Benxia HUANG, Wenshi Wang, Lina JIANG |
2023-02-14 |
| 11569177 |
Support frame structure and manufacturing method thereof |
Jindong FENG, Benxia HUANG, Lei Feng, Jiangjiang ZHAO, Wenshi Wang |
2023-01-31 |