Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787688 | Methods of forming MEMS diaphragms including corrugations | Sung Bok Lee, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Syskind PEDERSEN | 2023-10-17 |
| 11780726 | Dual-diaphragm assembly having center constraint | Michael Kuntzman, Michael Syskind PEDERSEN, Faisal Zaman, Xin Song | 2023-10-10 |
| 11772961 | MEMS device with perimeter barometric relief pierce | Michael Kuntzman, Ken Deng, Faisal Zaman, Bing Yu, Peter V. Loeppert | 2023-10-03 |
| 11716578 | MEMS die with a diaphragm having a stepped or tapered passage for ingress protection | Sung Bok Lee, Ankur R. Sharma, Nick Wakefield | 2023-08-01 |
| 11671766 | Microphone device with ingress protection | Sung Bok Lee, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin +1 more | 2023-06-06 |
| 11649161 | Diaphragm assembly with non-uniform pillar distribution | Mohammad Mohammadi, Xin Song | 2023-05-16 |
| 11617042 | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance | Michael Kuntzman, Michael Syskind PEDERSEN, Sung Bok Lee, Bing Yu, Peter V. Loeppert | 2023-03-28 |