Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787688 | Methods of forming MEMS diaphragms including corrugations | Sung Bok Lee, Vahid Naderyan, Bing Yu, Yunfei Ma, Michael Syskind PEDERSEN | 2023-10-17 |
| 11780726 | Dual-diaphragm assembly having center constraint | Michael Syskind PEDERSEN, Faisal Zaman, Xin Song, Vahid Naderyan | 2023-10-10 |
| 11772961 | MEMS device with perimeter barometric relief pierce | Ken Deng, Faisal Zaman, Bing Yu, Vahid Naderyan, Peter V. Loeppert | 2023-10-03 |
| 11671766 | Microphone device with ingress protection | Sung Bok Lee, Vahid Naderyan, Bing Yu, Yunfei Ma, Wade Conklin +1 more | 2023-06-06 |
| 11617042 | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance | Michael Syskind PEDERSEN, Sung Bok Lee, Bing Yu, Vahid Naderyan, Peter V. Loeppert | 2023-03-28 |