Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787688 | Methods of forming MEMS diaphragms including corrugations | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Michael Syskind PEDERSEN | 2023-10-17 |
| 11787690 | MEMS assembly substrates including a bond layer | John B. Szczech, Josh Watson | 2023-10-17 |
| 11716578 | MEMS die with a diaphragm having a stepped or tapered passage for ingress protection | Vahid Naderyan, Ankur R. Sharma, Nick Wakefield | 2023-08-01 |
| 11671766 | Microphone device with ingress protection | Vahid Naderyan, Bing Yu, Michael Kuntzman, Yunfei Ma, Wade Conklin +1 more | 2023-06-06 |
| 11617042 | Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance | Michael Kuntzman, Michael Syskind PEDERSEN, Bing Yu, Vahid Naderyan, Peter V. Loeppert | 2023-03-28 |