Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787690 | MEMS assembly substrates including a bond layer | Sung Bok Lee, Josh Watson | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11787690 | MEMS assembly substrates including a bond layer | Sung Bok Lee, Josh Watson | 2023-10-17 |