Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776877 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Jian Li, Jaspreet S. Gandhi, James M. Derderian +1 more | 2023-10-03 |
| 11594462 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2023-02-28 |
| 11562986 | Stacked semiconductor die assemblies with partitioned logic and associated systems and methods | Jian Li | 2023-01-24 |