Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817444 | Multi-chip packaging | Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |