Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621231 | Methods of fabricating leadless power amplifier packages including topside terminations | Yun Wei, Fernando A. Santos, Lakshminarayan Viswanathan | 2023-04-04 |
| 11621673 | Power amplifier packages and systems incorporating design-flexible package platforms | Jean-Christophe Nanan, David J. Dougherty, Lakshminarayan Viswanathan, Xavier Hue | 2023-04-04 |