Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791226 | Device on ceramic substrate | Je-Hsiung Lan, Jonghae Kim | 2023-10-17 |
| 11749746 | Radio frequency front end (RFFE) hetero-integration | Jonghae Kim, Je-Hsiung Lan | 2023-09-05 |
| 11689181 | Package comprising stacked filters with a shared substrate cap | Jonghae Kim, Je-Hsiung Lan, Milind Shah, Periannan Chidambaram | 2023-06-27 |
| 11652064 | Integrated device with electromagnetic shield | Jonghae Kim, Je-Hsiung Lan | 2023-05-16 |
| 11626236 | Stacked inductor having a discrete metal-stack pattern | Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Lan | 2023-04-11 |
| 11605620 | Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding | Je-Hsiung Lan, Jonghae Kim | 2023-03-14 |