Issued Patents 2023
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854889 | Die cleaning systems and related methods | — | 2023-12-26 |
| 11854995 | Supports for thinned semiconductor substrates and related methods | Francis J. Carney | 2023-12-26 |
| 11830771 | Semiconductor substrate production systems and related methods | — | 2023-11-28 |
| 11830756 | Temporary die support structures and related methods | Francis J. Carney | 2023-11-28 |
| 11823953 | Semiconductor substrate processing methods | — | 2023-11-21 |
| 11823965 | Substrate processing carrier | — | 2023-11-21 |
| 11756830 | Jet ablation die singulation systems and related methods | — | 2023-09-12 |
| 11710691 | Semiconductor device and method of forming micro interconnect structures | Francis J. Carney, Jefferson W. Hall | 2023-07-25 |
| 11694937 | Semiconductor wafer and method of probe testing | — | 2023-07-04 |
| 11676863 | Structures for aligning a semiconductor wafer for singulation | Takashi Noma | 2023-06-13 |
| 11652010 | Semiconductor substrate crack mitigation systems and related methods | — | 2023-05-16 |
| 11651998 | Plasma die singulation systems and related methods | — | 2023-05-16 |
| 11616008 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2023-03-28 |
| 11605561 | Backside metal removal die singulation systems and related methods | — | 2023-03-14 |
| 11581223 | Backside metal patterning die singulation system and related methods | — | 2023-02-14 |