Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11653484 | Printed circuit board automated layup system | James E. Benedict, Andrew R. Southworth, Wade A. Schwanda | 2023-05-16 |
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Gregory G. Beninati, James E. Benedict, Andrew R. Southworth | 2023-03-14 |