Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Mikhail Pevzner, James E. Benedict, Andrew R. Southworth | 2023-03-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Mikhail Pevzner, James E. Benedict, Andrew R. Southworth | 2023-03-14 |