Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11653484 | Printed circuit board automated layup system | Mikhail Pevzner, James E. Benedict, Wade A. Schwanda | 2023-05-16 |
| 11632856 | Wall for isolation enhancement | Kevin Wilder, James E. Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven | 2023-04-18 |
| 11606865 | Method for forming channels in printed circuit boards by stacking slotted layers | Mikhail Pevzner, Gregory G. Beninati, James E. Benedict | 2023-03-14 |