Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11829077 | System and method for determining post bonding overlay | Franz Zach, Xiaomeng Shen, Jason Saito, David Owen | 2023-11-28 |
| 11782411 | System and method for mitigating overlay distortion patterns caused by a wafer bonding tool | Franz Zach, Roel Gronheid | 2023-10-10 |
| 11682570 | Process-induced displacement characterization during semiconductor production | Pradeep Vukkadala, Ady Levy, Prasanna Dighe, Dieter Mueller | 2023-06-20 |