Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11829077 | System and method for determining post bonding overlay | Mark D. Smith, Xiaomeng Shen, Jason Saito, David Owen | 2023-11-28 |
| 11782411 | System and method for mitigating overlay distortion patterns caused by a wafer bonding tool | Mark D. Smith, Roel Gronheid | 2023-10-10 |