Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810894 | Solderless interconnect for semiconductor device assembly | — | 2023-11-07 |
| 11688706 | Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems | — | 2023-06-27 |
| 11682563 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Chih-Hong Wang | 2023-06-20 |
| 11621245 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Yeongbeom Ko, Youngik Kwon | 2023-04-04 |