Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705421 | Apparatus including solder-core connectors and methods of manufacturing the same | Po Chih Yang, Po Chen Kuo | 2023-07-18 |
| 11682563 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Jungbae Lee | 2023-06-20 |