Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764161 | Ground connection for semiconductor device assembly | Jong Sik Paek, Yeongbeom Ko | 2023-09-19 |
| 11621245 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Yeongbeom Ko, Jungbae Lee | 2023-04-04 |