Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855023 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim +1 more | 2023-12-26 |
| 11842970 | Semiconductor package and manufacturing method thereof | No Sun Park | 2023-12-12 |
| 11764161 | Ground connection for semiconductor device assembly | Youngik Kwon, Yeongbeom Ko | 2023-09-19 |
| 11749665 | Face-to-face semiconductor device with fan-out porch | Yeongbeom Ko | 2023-09-05 |