Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855023 | Wafer level fan out semiconductor device and manufacturing method thereof | Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim +1 more | 2023-12-26 |
| 11823982 | Semiconductor chip including through electrode, and semiconductor package including the same | Ho Young SON, Mi Seon LEE | 2023-11-21 |
| 11659776 | High temperature-superconducting wire having superconducting layer staked thereon and method for manufacturing same | Hong Soo Ha, Sang Soo Oh | 2023-05-23 |
| 11634800 | High-strength austenite-based high-manganese steel material and manufacturing method for same | Un-Hae Lee, Tae-Kyo Han, Sang-Deok Kang, Yong Jin Kim | 2023-04-25 |
| 11594471 | Semiconductor chip including through electrode, and semiconductor package including the same | Ho Young SON, Mi Seon LEE | 2023-02-28 |
| 11584970 | High manganese steel for low temperature applications having excellent surface quality and a manufacturing method thereof | Yu-Mi Ha, Young-Deok Jung, Sang-Deok Kang, Un-Hae Lee, Yong Jin Kim +1 more | 2023-02-21 |