Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823982 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Mi Seon LEE | 2023-11-21 |
| 11594471 | Semiconductor chip including through electrode, and semiconductor package including the same | Sung Kyu Kim, Mi Seon LEE | 2023-02-28 |