Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817438 | System in package with interconnected modules | Hyoung Il Kim, Bilal Khalaf, John G. Meyers | 2023-11-14 |
| 11694987 | Active package substrate having anisotropic conductive layer | Hyoung Il Kim | 2023-07-04 |