Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11690165 | Package substrate inductor having thermal interconnect structures | Michael J. Hill, Anne Augustine | 2023-06-27 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Amruthavalli Pallavi Alur, Kaladhar Radhakrishnan, William J. Lambert | 2023-06-13 |