Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11604150 | Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium | Takahisa Okuzono, Masaki Tomita, Jumpei Fujikata | 2023-03-14 |