Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11603601 | Plating device and resistor | Mitsuhiro Shamoto, Shao Hua Chang, Masashi Shimoyama | 2023-03-14 |
| 11604150 | Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium | Takahisa Okuzono, Jumpei Fujikata, Hideki Takayanagi | 2023-03-14 |
| 11600514 | Substrate holding device | Junitsu Yamakawa | 2023-03-07 |