Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11717796 | Paddle, plating apparatus equipped with the paddle, and plating method | Yasuyuki Masuda, Masashi Shimoyama, Yohei Wakuda, Shao Hua Chang | 2023-08-08 |
| 11686647 | Leak check method, leak check apparatus, plating method, and plating apparatus | Kiyoshi Suzuki | 2023-06-27 |
| 11604150 | Device for measuring bump height, apparatus for processing substrate, method of measuring bump height, and storage medium | Takahisa Okuzono, Masaki Tomita, Hideki Takayanagi | 2023-03-14 |