Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735435 | Quad flat no lead package and method of making | Dan Okamoto | 2023-08-22 |
| 11664276 | Front side laser-based wafer dicing | Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Shoichi Iriguchi, Genki Yano +2 more | 2023-05-30 |