Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848214 | Encapsulated semiconductor package | Ronald Patrick Huemoeller, Sukianto Rusli | 2023-12-19 |
| 11694906 | Semiconductor devices and methods of manufacturing semiconductor devices | Jae Yoon Kim, Ji Hun Lee, Suresh Jayaraman, Won Chul Do, Jin Young Khim +2 more | 2023-07-04 |
| 11676941 | Semiconductor package and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller, In Su Mok, Sang Hyoun Lee, Won Chul Do +1 more | 2023-06-13 |
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, Ronald Patrick Huemoeller, Roger D. St. Amand | 2023-05-16 |