Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Ronald Patrick Huemoeller | 2023-05-16 |
| 11621243 | Thin bonded interposer package | Christopher J. Berry, Jin Seong Kim | 2023-04-04 |