CB

Christopher J. Berry

AP Amkor Technology Singapore Holding Pte.: 1 patents #51 of 147Top 35%
📍 Chandler, AZ: #262 of 601 inventorsTop 45%
🗺 Arizona: #1,362 of 4,150 inventorsTop 35%
Overall (2023): #494,179 of 537,848Top 95%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11621243 Thin bonded interposer package Roger D. St. Amand, Jin Seong Kim 2023-04-04