Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848214 | Encapsulated semiconductor package | Sukianto Rusli, David Jon Hiner | 2023-12-19 |
| 11823913 | Method of manufacturing an electronic device and electronic device manufactured thereby | Bora Baloglu, Curtis Zwenger | 2023-11-21 |
| 11676941 | Semiconductor package and fabricating method thereof | David Jon Hiner, Michael Kelly, In Su Mok, Sang Hyoun Lee, Won Chul Do +1 more | 2023-06-13 |
| 11652038 | Semiconductor package with front side and back side redistribution structures and fabricating method thereof | Michael Kelly, David Jon Hiner, Roger D. St. Amand | 2023-05-16 |
| 11605552 | Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby | Bora Baloglu, Suresh Jayaraman, Andre Cardoso, Eoin O'Toole | 2023-03-14 |
| 11545405 | Packaging for fingerprint sensors and methods of manufacture | David Bolognia, Robert Francis Darveaux, Brett Dunlap | 2023-01-03 |