Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765814 | Devices and methods related to nested filters | Ki Wook Lee, Takeshi Furusawa, Sundeep Nand Nangalia, Russ Alan Reisner, John C. Baldwin | 2023-09-19 |
| 11596056 | Methods and devices related to reduced packaging substrate deformation | Bhuvaneshwaran Vijayakumar, Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen | 2023-02-28 |
| 11545405 | Packaging for fingerprint sensors and methods of manufacture | Ronald Patrick Huemoeller, David Bolognia, Brett Dunlap | 2023-01-03 |