Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11596056 | Methods and devices related to reduced packaging substrate deformation | Lori Ann DeOrio, Anthony James LoBianco, Hoang Mong Nguyen, Robert Francis Darveaux | 2023-02-28 |