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AP Amkor Technology Singapore Holding Pte.: 1 patents #51 of 147Top 35%
Overall (2023): #415,116 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11676941 Semiconductor package and fabricating method thereof David Jon Hiner, Michael Kelly, Ronald Patrick Huemoeller, Sang Hyoun Lee, Won Chul Do +1 more 2023-06-13