Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810876 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault | 2023-11-07 |
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Isaac Rivera, James F. Buckwalter | 2023-09-12 |
| 11733297 | Built in self-test of heterogeneous integrated radio frequency chiplets | James Buckwaiter, Michael D. Hodge, Justin Kim, Florian G. Herrault | 2023-08-22 |