Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2023-09-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Daniel S. Green, James F. Buckwalter | 2023-09-12 |