Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810876 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | James F. Buckwalter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2023-11-07 |
| 11769843 | Photonic integrated module with metal embedded chips | Daniel Yap, Christopher S. Roper, Partia Naghibi | 2023-09-26 |
| 11756783 | Method for creating cavities in silicon carbide and other semiconductor substrates | Eric M. Prophet, Joel C. Wong | 2023-09-12 |
| 11756848 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Isaac Rivera, Daniel S. Green, James F. Buckwalter | 2023-09-12 |
| 11733297 | Built in self-test of heterogeneous integrated radio frequency chiplets | James Buckwaiter, Michael D. Hodge, Justin Kim, Daniel S. Green | 2023-08-22 |
| 11721605 | Wafer-level integrated micro-structured heat spreaders | Chia-Ming Chang | 2023-08-08 |