Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824030 | Mechanical punched via formation in electronics package and electronics package formed thereby | Youichi Nishihara | 2023-11-21 |
| 11630086 | Sensor system and method | Joseph Alfred Iannotti, David Richard Esler | 2023-04-18 |
| 11551993 | Power overlay module and method of assembling | David Richard Esler, Arun Virupaksha Gowda, Weijun Yin, Liqiang Yang, Richard Anthony Eddins | 2023-01-10 |