Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605609 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Shakti Singh Chauhan | 2023-03-14 |
| 11551993 | Power overlay module and method of assembling | David Richard Esler, Christopher James Kapusta, Weijun Yin, Liqiang Yang, Richard Anthony Eddins | 2023-01-10 |