Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824030 | Mechanical punched via formation in electronics package and electronics package formed thereby | Christopher James Kapusta | 2023-11-21 |
YN
Youichi Nishihara
Overall (2023): #192,893 of 537,848Top 40%
1
Patents 2023