Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855002 | Warpage control in microelectronic packages, and related assemblies and methods | Shams U. Arifeen | 2023-12-26 |
| 11769752 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Shams U. Arifeen, Koustav Sinha | 2023-09-26 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Koustav Sinha, Chan H. Yoo | 2023-08-15 |
| 11664360 | Circuit board with spaces for embedding components | Quang Nguyen, Shams U. Arifeen, Koustav Sinha | 2023-05-30 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Shams U. Arifeen, Koustav Sinha, Xiao Li | 2023-05-09 |
| 11552029 | Semiconductor devices with reinforced substrates | Koustav Sinha, Shams U. Arifeen | 2023-01-10 |