Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Shou-Zen Chang, Chun-Lin Lu | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749648 | Circuit structure for testing through silicon vias in three-dimensional integrated circuit | Shou-Zen Chang, Chun-Lin Lu | 2023-09-05 |