Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805602 | Chip assemblies | Loke Yip Foo, Teong Guan Yew | 2023-10-31 |
| 11652026 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2023-05-16 |
| 11562959 | Embedded dual-sided interconnect bridges for integrated-circuit packages | Loke Yip Foo, Teong Guan Yew | 2023-01-24 |