Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776926 | Combination-bonded die pair packaging and associated systems and methods | Kyle K. Kirby | 2023-10-03 |
| 11756844 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Mark E. Tuttle | 2023-09-12 |
| 11658129 | Electrically or temperature activated shape-memory materials for warpage control | — | 2023-05-23 |