Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848311 | Microelectronic packages having a die stack and a device within the footprint of the die stack | — | 2023-12-19 |
| 11817438 | System in package with interconnected modules | Hyoung Il Kim, Juan E. Dominguez, John G. Meyers | 2023-11-14 |
| 11811182 | Solderless BGA interconnect | Tyler Leuten, Mohammed Rahman | 2023-11-07 |
| 11710674 | Embedded component and methods of making the same | Yi Xu, Dennis Sean Carr | 2023-07-25 |
| 11700696 | Buried electrical debug access port | Florence R. Neumann, Saeed S. Shojaie | 2023-07-11 |