Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11734174 | Low overhead, high bandwidth re-configurable interconnect apparatus and method | Huichu Liu, Tanay Karnik, Tejpal Singh, Yen-Cheng Liu, Lavanya Subramanian +6 more | 2023-08-22 |
| 11735652 | Field effect transistors having ferroelectric or antiferroelectric gate dielectric structure | Seiyon Kim, Uygar E. Avci, Joshua M. Howard, Ian A. Young | 2023-08-22 |
| 11723188 | Replacement metal COB integration process for embedded DRAM | Uygar E. Avci, Ian A. Young, Seiyon Kim, Yih Wang, Ruth A. Brain | 2023-08-08 |