Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11734174 | Low overhead, high bandwidth re-configurable interconnect apparatus and method | Huichu Liu, Tanay Karnik, Tejpal Singh, Yen-Cheng Liu, Mahesh Kumashikar +6 more | 2023-08-22 |