Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791169 | Dual step laser processing of an encapsulant of a semiconductor chip package | Pei Luan Pok, Roslie Saini bin Bakar, Chau Fatt Chiang, Chee Hong Lee, Swee Kah Lee +2 more | 2023-10-17 |