Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Jürgen Schredl | 2023-11-14 |
WY
Woon Yik Yong
Overall (2023): #205,650 of 537,848Top 40%
1
Patents 2023